The Pick and Place is designed for assembling electronic circuits. It uses OpenPnP and is based on a design from Erich Styger.

The basic process for surface mount circuit board assembly is:

1. Using a stencil apply solder paste to the board where the component pads will be soldered
2. Put the board in the pick and place and place all the components on the board in their positions
3. Move the board to the reflow oven and heat it to melt the solder thus soldering the components in place

The reason for using a pick and place instead of manually placing the parts is two-fold:

1. The pick and place is faster and more accurate
2. Some of the parts are too small for a human to easily grasp - the vacuum nozzle on the pick and place can handle them easily